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Heated-air Circulating Type Clean Oven for 300mm Wafer SO2-12-F

The clean oven processes 300 mm (12-inch) wafers for semiconductor production. With FOUPs, 50 wafers/chamber can be fully automatically processed. Use the system for low-temperature processing of polyimide and other materials.
Heated-air Circulating Type Clean Oven for 300mm Wafer SO2-12-F

Feature

  • Full automatic clean oven for FOUP operation
  • Max 50 wafers / chamber
  • One robot enable additional 2 chambers
  • 2 FOUP / chamber
  • High speed wafer transfer by double wafer handling robot

The clean oven for semiconductor production has been developed by introducing the best-selling FPD manufacturing equipment, single wafer processing clean oven. The oven can fully automatically run using 300 mm (12-inch) FOUPs. 50 wafers/chamber can be processed and up to 2 chambers can be installed (2 FOUPs are used for each chamber). High throughput in short cycle time is realized in low-temperature processing of polyimide and other materials.

Outer dimension (mm) 3300(W)×3105(D)×2200(H) (three-stage furnace)
Heating method Heated-air circulating
Heater Sheathed heater
Operation temperature 70~450°C
Flat zone length (mm) 500
Wafer size (mm) 300
Batch size 50 wafers
I/O port 2~4
Finger 2 wafer
Controller Controller
HOST communication GEM300
Option Notch aligner
Applications (Polyimide)Cure, Dehydration baking
Manufactured article 300mm (12 inch) wafer