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Vertical Furnace for 300mm Wafer VF-5700

The heat treatment system performs silicon wafer, IGBT, polyimide and thin wafer oxidation, diffusion and CVD. Since the height is less than 3000 mm, this model can be easily introduced and accomplish short cycle time and high throughput.
Vertical Furnace for 300mm Wafer VF-5700

Feature

  • Mini Batch, flexible 25 to 50 wafers batch processing
  • Max 12 FOUP stocks
  • High throughput by high-power heater with fast heat up
  • High-speed wafer transfer by use of single/five wafers handling robot
  • ・ Equipped with operator friendly high performance control system

The short cycle time, high throughput, vertical diffusion furnace processes 300-mm (12-inch) wafers in a mini batch of 25–50 wafers each. Since the stocker space is eliminated, the height is less than 3000 mm and easy to introduce. There are many cases where furnaces are introduced without stockers, so you can cut the stocker-related costs. Thanks to the LGO heater, the furnace exhibits superior temperature characteristics over a wide range from low temperatures to middle to high temperatures, and is suitable for the heat treatment of IGBT, polyimide, thin wafers and other materials in addition to silicon wafers.

Outer dimension (mm) 1250(W)×3200(D)×2850(H)
Heater High power LGO heater (ID Φ550mm)
Flat zone length (mm) 500
Wafer size (mm) 300
Batch size 50 wafers
I/O port 2
Number of FOUP stock 12
Finger 5 wafers+single wafer
Controller Model VSC1000
Option Forced-cooling system, N2 load lock, HOST communication(GEM300), Stocker less type
Applications Oxidation, Diffusion, Chemical Vapor Deposition
Manufactured article Silicon, IGBT , Polyimide, Thin Wafer