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Semiconductor

Mass-Production Model Flexible Vertical Furnace VF-5100 Mass-Production Model Flexible Vertical Furnace VF-5100 The large-batch, diffusion, LPCVD, vertical furnace performs 4- to 8-inch wafer ultra high-temperature treatment. The system can be flexibly configured to meet your production line to process a variety of products. The furnace is best for power device manufacture.
Low-Cost Mini Batch Vertical Furnace VF-3000 Low-Cost Mini Batch Vertical Furnace VF-3000 The low-price vertical furnace equipped with an auto conveyor can be used for the range from R&D to mass-production of 4- to 8-inch wafers. We have achieved such a low price that after-process users can introduce the furnace. Ultra high-temperature treatment is available and best suited for power device manufacture.
Vertical Furnace for a small of production and R&D VF-1000 Vertical Furnace for a small of production and R&D VF-1000 The small production type vertical furnace for experiments and researches (R&D) achieves high-quality processing. The furnace is compact and requires only a small installation area but usable for a wide range of wafer diameter and exhibits the same temperature characteristics as those of mass-production furnaces.
Horizontal Furnace for PV Production Model 206A Horizontal Furnace for PV Production Model 206A The horizontal furnace is suitable for solar battery and photovoltaic (PV) cell production. 100 – 156 square wafers can be mass-processed in a batch of 200 – 400 wafers each.
Lamp Annealing System for Speedy Thermal Processing RLA-3100 Lamp Annealing System for Speedy Thermal Processing RLA-3100 The system for 4- to 8-inch wafers performs activation and oxidation in a vacuum (LP) environment and N2 load-lock atmosphere. The upper and lower cross lamps (halogen) and a soaking system are used, for higher in-plane temperature distribution uniformity.
Lamp Annealing System for Speedy Thermal Processing RLA-1200 Lamp Annealing System for Speedy Thermal Processing RLA-1200 The lamp annealing system for 4-inch to 8-inch wafers achieves high-quality processing even for use in R&D. Activation and oxidation are available in a vacuum (LP) environment and N2 load-lock atmosphere.

Advanced Technology Industry

Clean Oven, Single Substrate Transfer Type CCBS series Clean Oven, Single Substrate Transfer Type CCBS series Our best-selling clean ovens for LCDs and OLEDs! Zero-damage to substrates, Treatment of sublimates during color filter resist post baking.
Roller Hearth Continuous Furnace RH series Roller Hearth Continuous Furnace RH series Transfers large glass substrates cleanly and continuously for heat treatment using special ceramic rollers. Also capable of sealing OLED frit glass.

Conveyor Furnace for Electronics Industry

Standard Muffle Furnace Standard Muffle Furnace Mesh-belt type continuous furnace using a muffle with excellent in-furnace atmosphere stability and reproducibility. Suitable for brazing, soldering, thick film baking, electrode drying, and de-binding.
Hydrogen Furnace Hydrogen Furnace Mesh-belt type continuous furnaces to be used for treatment in reducing atmosphere, such as metal brazing and glass sealing. Easy to handle because of the H2 atmosphere mechanism with consideration given to safety.
Multi-Inlet/Exhaust Furnace for Nitrogen Atomosphers Multi-Inlet/Exhaust Furnace for Nitrogen Atomosphers Mesh-belt type continuous furnace enabling high precision N2 atmosphere separation using the latest gas control technology. Suitable for LTCC substrate and MLCC manufacturing, de-binding, and powder metallurgy baking.
Muffle-less Furnace Muffle-less Furnace Muffle-less furnace (atmosphere furnace) with suppressed heat dissipation and enhanced energy-saving effect. Suitable for LTCC substrate and inductor manufacturing, thick film baking, and glass sealing.
Ceramic Conveyor Type Continuous Furnace Ceramic Conveyor Type Continuous Furnace Special ceramic chains, excellent in heat resistance and abrasion resistance, are used as a transfer conveyor. Muffle-less, Ceramic semi-muffle, and Metal muffle types are selectable.
Compact Conveyor Furnace 810A Compact Conveyor Furnace 810A Small size with a reduced installation area, and capable of heat treatment in various atmospheres. Small conveyor furnace suitable for thick film baking, electrode drying, and ceramic substrate manufacturing experimentation.
In-line Type Vacuum Reflow Soldering Furnace In-line Type Vacuum Reflow Soldering Furnace Rapid and uniform heating is actualized by Halogen lamps. Nitrogen Atomosphers.
Clean Oven (Order Products) Clean Oven (Order Products) Continuous ovens originally manufactured using technologies for FPD manufacturing and clean oven for experimentation. For electronic parts, disks, glass epoxy substrates, film drying, curing, and annealing.

Laboratory Electric Furnace & Oven

Muffle Equipped Box Furnace KBF 1250 deg C-S Muffle Equipped Box Furnace KBF 1250 deg C-S Experiment and laboratory research use desktop electrical furnaces (box furnaces) developed by installing metallic muffles in the KBF 1250 deg C series furnaces so that heat treatments at 1000 deg C can be carried out within airtight vessels.
Vacuum Purge Type Small Box Furnace uBF Vacuum Purge Type Small Box Furnace uBF Based on the KBC series which has a good delivery record, the vacuum purge structure reduces the purging time. The multi-purpose electrical box furnaces perform heat treatments in a N2 atmosphere or H2 (reducing) atmosphere.
Compact Continuous Furnace 810A Compact Continuous Furnace 810A The compact furnaces require only small installation areas and perform heat treatments in a H2 (reducing) atmosphere. The compact conveyor furnaces are optimal for thick film firing, electrode drying and ceramic board manufacture experiments.
Vacuum Bake Furnace Vacuum Bake Furnace The electrical box furnace developed for heat treatments in a vacuum environment. The furnace performs baking, drying, degreasing, hardening, annealing and various other treatments in short cycle time.
High-Tempe Atmosphere Box Furnace High-Tempe Atmosphere Box Furnace Introduction of high-temperature atmosphere box furnaces that can perform high-temperature processing (firing, sintering and annealing) in N2, H2, vacuum and various other atmospheres.
Vacuum Purge Typel Box Furnace MB series Vacuum Purge Typel Box Furnace MB series The KBF1150 deg C type compact electrical furnace was refined and remodeled to this floor type box furnaces. N2 atmosphere replacing time is reduced by vacuum purge. The heat treatment furnaces are suitable for LTCC and MLCC manufacture.
Exhaust Gas Burn-out System GM Series Exhaust Gas Burn-out System GM Series Organic matters in the exhaust gas from ceramics temporary sintering and electronic part defatting are completely burnt. Exhaust gas thermal cracking is available at a maximum of 850 deg C.